Inventors of the patented process for treating assembled printed circuit boards using electroless nickel plating to eliminate tin whiskers.
Whisker problems have been experienced by SMART Group members on PCB
surface finishes and component terminations. Even when all of the
existing mitigating practices have been followed [these problems] can
Given the long history and current use of electroless nickel, both on circuit board bare fabs and components, along with the historic tin whisker testing on nickel coated components, it looks like the search for an effective, easily-reworkable, easily-implemented, cost-effective process for the elimination of tin whiskers is over.
First time here? See our introduction.
Learn about our revolutionary new process that applies electroless nickel to electronic assemblies to eliminate (not just mitigate) the tin whisker problem. Whisker Inpenetrable Metal Cap Process for Electronic Assemblies (PDF)
Whisker-Inpenetrable Metal Cap Process for Electronic Assemblies (PDF) Landman, Davy, Fritz; Reliability Society 2010 Annual Technical Report
52 Years Later—Tin Whiskers Still Elude a Comprehensive Solution An LDFCoatings summary of NASA Goddard Space Flight Center studies; February 28, 2021
Electronic Assembly with Solder: an Unblinking Look at "The Devil We Know", Joe Fjelstad, Guest Column, SMT Magazine July 2014
Unredacted NASA Technical Assessment Report of NHTSA Toyota Unintended Acceleration Investigation PRIOR to Toyota's redaction before release to the public. (177 pages)
Electrical Failure of an Accelerator Pedal Position Sensor Caused by a Tin Whisker...; Leidecker, Panashchenko, Brusse; CALCE 5th Internation Tin Whisker Symposium
Toyota's Sudden Acceleration Problem May Have Been Triggered By Tin Whiskers; Silke Carty, Sharon; The Huffington Post, www.huffingtonpost.com; January 24, 2012
Tin Whiskers Problems, Causes, and Solutions U.S. Food & Drug Administration, Department of Health, March 14, 1986
Read John Burke's full article at: http://www.pcbdesign007.com/pages/zone.cgi?a=71147
NASA's Goddard Space Flight Center tin whisker page:
Osborn, Kris. "Army Works to Decrease Lead-Free Electronic Components." Army AL&T Online. Sept. 2010. http://www.army.mil/article/40712/army-works-to-decrease-lead-free-electronic-components/
Tin Whiskers—A Long Term RoHS Reliability Problem (PDF); Robert J. Landman, H&L Instruments; IEEE Reliability Society 2008 Annual Technology Report.
A comprehensive compilation of tin whisker articles, PowerPoint presentations, movies, and pictures: http://www.hlinstruments.com/RoHS_articles
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