Inventors of the patent-pending process for treating assembled printed circuit boards using electroless nickel plating to eliminate tin whiskers.
We want to hear from you. Have you experienced tin whisker issues in your PCB manufacturing process? Have you had some level of success in mitigating the tin whisker problem in your process? Would you like more information about LDF Coatings patent-pending process? Would you like to speak to someone about this new process?
PO Box 580
North Hampton, NH
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